现代塑料加工应用

2004, (05) 9-10

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低熔点双组分合金填充HDPE导电性能研究
UDY ON ELECTRICAL CONDUCTIVITY OF HDPE FILLED WITH LOW MELTING POINT DUAL COMPONENT ALLOY </h3> <div style="width: 85%; float: left;"> <div class="content1"> <h4> 孙义明,孟庆浩,彭少贤,杨宇红 </h4> <ul> <li id="authorUnit1" style="display: none"> 1:湖北工业大学化工系</li> <li id="authorUnit2" style="display: none"> 2:湖北工业大学化工系 </li> <li id="authorUnit3" style="display: none"> 3:湖北工业大学化工系 </li> <li id="authorUnit4" style="display: none"> 4:湖北工业大学化工系 武汉 </li> <li></li> </ul> <p id="digest"> <strong>摘要(Abstract): </strong> </p> <p> 对低熔点双组分合金(铋和铅)填充高密度聚乙烯(HDPE)导电性能进行了研究分析,结果显示:随着金属填充量增大,填充体系的导电性能提高,金属填充量大于40%,表面电阻率和体积电阻率分别降低6个和8个数量级;第3组分的加入显著提高了填充体系的导电性能,体积电阻率从3.9×1016 Ω·cm下降到1.5×1015 Ω·cm。</p> <p> <strong>关键词(KeyWords):</strong> 低熔点金属;双组分;合金;填充;高密度聚乙烯;导电性能;铋;铅 </p> <p style="display: none;"> <strong>Abstract: </strong> </p> <p style="display: none;"> <strong>Keywords: </strong> </p> <p> <strong>基金项目(Foundation):</strong> 国家自然科学基金项目(编号29544013)</p> <p> <strong>作者(Author):</strong> 孙义明,孟庆浩,彭少贤,杨宇红 </p> <p> <strong>Email:</strong> </p> <p> <strong>DOI:</strong> </p> </div> <div class="content1"> <h4> 参考文献(References):</h4> <ul class="UL_list1"> <li><a>1 Kiss G. In situ compositions: blends of isotropic polymer and thermorotpic liquid crystalline polymer. Polym Eng Sci,1987,27 (6):410 </a></li><li><a>2 Miyarchi S. The conduction mechanism of polymer filler particle. J Apply Polym Sci,1985,30(7):2 743</a></li> </ul> </div> </div> <div class="addAction" style="width: 12%; float: right;"> <div class="addAction_title"> 扩展功能</div> <!-- addAction_title --> <div class="addAction_title_sec"> 本文信息</div> <!-- addAction_title_sec --> <ul> <li><a href="#" onclick="downloadpaper();">PDF(133k)</a></li> </ul> <div class="addAction_title_sec"> 服务与反馈</div> <!-- addAction_title_sec --> <ul> <li><a href="#" onclick="copyToBoard()">引用本文</a></li> <li style="display: none;"><a href="#" onclick="searchComent()">浏览反馈信息</a></li> </ul> <div class="addAction_title_sec"> 本文关键词相关文章</div> <!-- addAction_title_sec --> <ul> <li><a href="../WebPublication/searchPaper.aspx?kwd=%e4%bd%8e%e7%86%94%e7%82%b9%e9%87%91%e5%b1%9e" target="_blank">低熔点金属</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e5%8f%8c%e7%bb%84%e5%88%86" target="_blank">双组分</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e5%90%88%e9%87%91" target="_blank">合金</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e5%a1%ab%e5%85%85" target="_blank">填充</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e9%ab%98%e5%af%86%e5%ba%a6%e8%81%9a%e4%b9%99%e7%83%af" target="_blank">高密度聚乙烯</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e5%af%bc%e7%94%b5%e6%80%a7%e8%83%bd" target="_blank">导电性能</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e9%93%8b" target="_blank">铋</a></li><li><a href="../WebPublication/searchPaper.aspx?kwd=%e9%93%85" target="_blank">铅</a></li> </ul> <div class="addAction_title_sec"> 本文作者相关文章</div> <!-- addAction_title_sec --> <ul> <li><a href="../WebPublication/searchAuthorPaper.aspx?uid=ck&unm=%e5%ad%99%e4%b9%89%e6%98%8e&nm=%e5%ad%99%e4%b9%89%e6%98%8e" target="_blank">孙义明</a></li><li><a href="../WebPublication/searchAuthorPaper.aspx?uid=ck&unm=%e5%ad%9f%e5%ba%86%e6%b5%a9&nm=%e5%ad%9f%e5%ba%86%e6%b5%a9" target="_blank">孟庆浩</a></li><li><a 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